| 摘要 |
PROBLEM TO BE SOLVED: To improve connection reliability of electrode and protect the surface of an integrated circuit. SOLUTION: An insulating layer 204, which becomes pedestals 404a and 404b, is formed on a semiconductor integrated-circuit substrate 100 where a wiring 100 is formed. Then, an opening 406 where the wiring 101 is exposed is formed in the insulating layer 204. Polyimide resin is used as the insulating layer 204. Next, a conductive film 205 which becomes conductor 405 is formed on the insulating layer 204, and the conductive film 205 is patterned with photoresist 207 as a mask such that a portion from the surface of the wiring 101 in the opening 406 to a predetermined surface region (where the pedestal 404a is to be formed) of the insulating layer 204 is left. Finally, the surface of the insulating layer 204 in a portion to be the pedestal 404b is removed by a predetermined thickness, with the conductor 405 as a mask, to form the pedestals 404a and 404b having different heights. |
