| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the reliability and product yields of a semiconductor device by preventing out-of-focusing during exposure due to effect from dust existing on the obverse side of a stage body or on the reverse side of a wafer. SOLUTION: This stage 1 is provided with a stage main body 2 for sucking and holding a wafer placed thereon, and grooves 5 for sucking the wafer are made on the obverse side of the stage body 2. The opening area of the grooves 5 is made larger than the area of contact portions 2a, where the obverse side of the stage body 2 is put into contact with the wafer placed thereon.</p> |
