CHIP CARRIER BOARD FOR SEMICONDUCTOR PACKAGE, MANUFACTURE THEREOF, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To realize simultaneous and quick formation of a multiple number of holes with low costs by chemically forming holes for external connection terminals in a chip carrier board for a semiconductor package. SOLUTION: A 18μm-thick copper foil 1, a 25μm-thick insulating layer 2 and a film 4 having a photosensitive layer 3 are compressed by a laminator into a laminate. The photosensitive layer 3 is printed and developed to make holes therein. Then, the insulating layer 2 is etched with use of the developed layer 3 as an etching resist to make the holes. The photosensitive layer 3 is released, and then a circuit is formed on the copper foil 1 with the insulating layer used as a carrier board as it is. As a result, a chip carrier board for a semiconductor package is obtained.