| 摘要 |
The invention concerns surface treatment methods, in particular the metallization of non-conducting substrates. More precisely, the invention concerns a chemical metallization by splattering oxidising/reducing (Ox/Red) aerosol(s), thereby eliminating the drawbacks of chemical plating and chemical atomisation processes. Said method consists in splattering in at least two successive splattering phases, alternating with relaxation phases by fixing the duration of the splattering phases between 10<-2> and 5 s, preferably between 10<-1> and 3 s for the same unit area, and the duration of the relaxation phases between 1 x 10<-2> and 10 s, preferably between 2 x 10<-1> and 4 s, for the same unit area. The invention is applicable to the metallization of plastics, anti-corrosion treatment, treatment for reducing coefficient of friction and electromagnetic armouring.
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