| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable constituting a double-sided board mounting type semiconductor integrated circuit device constituted of an integrated circuit chip, having a board bias generating circuit and an integrated circuit chip which does not have a board bias generating circuit, without incurring cost increase. SOLUTION: This device is a resin-molded type semiconductor integrated circuit device, wherein a DRAM chip 11 and a mask ROM chip 12 are mounted on the both surface of a chip-mounting part 15 of a conductive lead frame, and the parts between the respective electrodes of the respective ships and the respective lead terminals are connected by bonding wires. The device is so constituted that the DRAM chip 11 has a board bias generating circuit 13, and the other mask ROM chip 12 does not have a board bias generating circuit. The threshold voltage of a MOS transistor arranged in the mask ROM chip 12 which does not have the board bias generating circuit is set to be lower than that of the case that a semiconductor integrated circuit device is constituted by molding only the mask ROM chip 12 with resin.</p> |
