| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent peeling by a protection film even though the peeling runs along a wiring layer when peeling is generated from a cut-off point of the wiring layer, by coating both sides of the wiring layer except the cut-off points with a protection film. SOLUTION: A transparent substrate is provided with a wiring layer comprising a metallic layer thereon and an ITO film 18 formed by coating the metallic layer, and this wiring layer has points to be cut off by being irradiated with laser light. And, for example, it has a video signal line 3 of Cr-Mo alloy and a protection film 12 is formed on both sides except the cut-off point (C-C line). The video signal line 3 in the neighborhood of the cut-off area, namely, the upper surface of the video signal line 3 exposed out of the protection film 12, is coated with ITO film 18, which spreads out its both ends on the protection film 12. In a case of a scanning line when the wiring layer is formed of Cr or its alloy, a similar configuration is adopted for the cut-off point.</p> |
