| 摘要 |
PROBLEM TO BE SOLVED: To enhance resolution and the other resist performances in the manufacture of semiconductor devices by incorporating a specified alkali-soluble resin and a specified photosensitive agent and a specified polyhydroxyl compound in the positive photosensitive composition. SOLUTION: This positive photoresist composition comprises the alkali-soluble resin and the photosensitive agent and the polyhydroxyl compound. The alkali- soluble resin is obtained by condensation reaction of phenols containing at least one monomers selected from 2,3-xylenols and the like in an amount of >=15 mol.% of the total monomers, with aldehydes, and it has a weight average molecular weight of 2,500-10,000 and a dispersion degree of 1.5-4.0. The photosensitive agent has a number of the total aromatic and aliphatic rings of 3-7 and 3-5 phenolic hydroxyl groups, and the polyhydroxyl compound has a molecular weight of 200-1000 and 2-7 hydroxyl groups. |
