| 摘要 |
PROBLEM TO BE SOLVED: To relieve mechanical stresses and facilitate mounting of solder balls by installing a semiconductor element connected with a conductor wiring, conductive material with which aperture holes are filled to be smaller than the thickness of an insulating film, and the solder balls connecting the conductive material and a mother board. SOLUTION: Aperture holes are formed in an insulating film 2, and a conductor wiring 3 is formed on the insulating film 2. The conductor wiring 3 and an electrode of a semiconductor element 1 are electrically and mechanically connected, and sealing is performed with a sealing resin 4 for protecting the connecting part of the conductor wiring 2 and the electrode. The aperture hole of the insulating film 2 is filled with a conductive material 5 to be smaller then the thickness of the insulating film 2. Solder balls 6 are mounted on the conductive material 5, and a semiconductor device and a mother board 7 are connected by reflow after the solder balls 6 have been aligned with a pattern of the mother board 7. As a result, the gap between the insulating film 2 and the mother board 7 can be held wide, and mechanical stresses or the like can be relaxed. |
