MULTI-LAYER WIRING BOARD AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To provide a multi-layer wiring board with excellent plated copper adhesive force and without peeling-off of a resin. SOLUTION: A multi-layer wiring board forms an insulation layer on inner layer wiring 1 formed on a substrate 2 and this insulation layer is constituted so that a photosensitive resin 4 as a light source side layer having a characteristic absorbing activated light for a narrow area up to an effective wavelength lower than the characteristic of the photosensitive resin 3 to be insoluble is overlapped on the photosensitive resin 3 as a blind via hole bottom part 5 side layer having the characteristic absorbing the activated light ranging a wide area up to a relatively high effective wavelength to be insoluble and is made a multiple layer.