| 摘要 |
A semiconductor device is disclosed which employs transfer molding to simplify a resin sealing step, reduces fabrication costs without using expensive elements, and has an improved efficiency of dissipation of heat generated by a power device and an improved product rating. The power device (101) and a control device (102) are placed in predetermined positions on horizontally positioned lead frames (103a, 103b), respectively. An insulating layer (105) of epoxy resin or the like is formed on a major surface of a heat sink (104), and a circuit pattern layer (106) formed on a major surface of the insulating layer (105) is shaped to conform to a predetermined circuit pattern. The lead frames (103a, 103b) are disposed on the circuit pattern layer (106). |
