| 摘要 |
PROBLEM TO BE SOLVED: To reduce stress to an electronic component and prevent characteristics deterioration of the electronic component, by forming bump electrodes on a board for mounting the electronic component, aligning the bump electrodes with terminal electrodes of the electronic component, and bonding them by thermal reaction. SOLUTION: A capillary 5 is made to descend, and an Au ball is mounted on a wiring electrode 1a and fixed by ultrasonic vibration or thermocompression bonding. An Au wire 3 is fastened in the upper part of the capillary 5, pulled up and cut, thereby forming a bump electrode 11 on the wiring electrode 1a. A terminal electrode 15a of an electronic component 15 sucked by a heat tool 13 having a suction hole 13a is made to align with a bump electrode 11. The electronic component 15 is mounted on a board 1 by face down. The temperature of the heat tool 13 is raised, and a load is applied. As a result, the bump electrode 11 is thermocompression bonded to the terminal electrode 15a. |
