| 摘要 |
PROBLEM TO BE SOLVED: To provide a TCP(tape carrier package) semiconductor device where the disconnection of an inner lead and the peeling and the crack of protection resin do not occur on the small semiconductor element of multiple pins, which has a high integration degree. SOLUTION: An inner lead 2 of a TAB(tape automated bonding) film carrier is formed so that it terminates at an opening part without being protruded from a device hole 8. A film carrier tape alignment pattern 46 for positioning with the semiconductor chip is formed at the corner part of the square opening in the device hole 8. A semiconductor chip 4 where a semiconductor chip alignment pattern 47 is formed and the pattern 46 are positioned by setting the inner lead 2 to be a lower face, and them are joined by bonding. A resin pass hole leading protection resin 30 to the lower part of a film carrier tape 1 is perforated at the peripheral part of the device hole 8. A first recessed part 65 for controlling resin in-flow rate, which is formed of a continuous groove circulating the opening of the device hole 8, and a second recessed part 66 for reinforcing adhesion force which is constituted of a dent having a circular surface form, are provided at the periphery of the opening of the device hole 8. |
