| 摘要 |
PROBLEM TO BE SOLVED: To form a microwave integrated circuit element through a simple process and to reduce the chip area of the element by forming a concentrated constant circuit, etc., which requires micro fabrication on the surface of a semiconductor substrate and a distributed constant circuit which requires relatively less micro fabrication as an upper layer through a dielectric layer. SOLUTION: In the structure of an MMIC chip, an insulator layer 80 having a thickness of about 1 μm is formed so as to cover the surface of a GaAs substrate 10 on which a concentrated constant circuit, etc., and a planar GND line 90 constituting a microstrip line is formed on the surface of the layer 80. In addition, a thick dielectric layer 100 is formed so as to cover the surfaces of the GND line 90 and insulator layer 80 and a signal line 110 is formed on the surface of the layer 100. The GND line 90, dielectric layer 100, and signal, line 110 constitute the microstrip line. Therefore, in order to form the microstrip line, the other concentrated constant circuit, etc., three-dimensionally, the utilizing efficiency of the chip area is improved so that the size of the chip may be reduced. |
