Chip card manufacturing method

摘要

The method involves manufacturing chip cards with an IC chip for processing electric signals and contact elements for communication with external devices and terminals. The arrangement and dimensions of the contact elements on the chip card satisfy the requirements of ISO standard 7816. The surface of the IC chip used corresponds at least to the surface which provides all contact elements. The contact elements are arranged directly on the surface of the IC chip. Preferably the IC chip is adhered into recesses provided in the card body, such that the adhesive only fills part of the space between the card body and the IC chip.