| 摘要 |
<p>A patterned specimen inspection system (10) achieves the inherent advantages of the die to statistical image (DSI) inspection mode for repetitive patterns (14) and random patterns (16) and simultaneously achieves the inspection speed of the optical pattern filtering (OPF) mode. A preferred embodiment entails producing a patterned speciment wafer image with coherent optical spatial frequency filtering (28), as in the OPF mode, and carrying out defect detection by pixel comparison, as in the DSI mode. For repetitive and random pattern areas implementation of the invention increases the inspection speed of the DSI mode to approach that of the OPF mode because image spatial filtering enables the use of a large sized unit pixel (20).</p> |
