| 摘要 |
PROBLEM TO BE SOLVED: To obtain high reliability without disengaging a coil antenna by molding a circular coil antenna, and a base film adhesively fixed with a circuit module connected to the antenna as basses, eccentrically disposing the module from a central axis, and forming a card. SOLUTION: A lead wire of a coil antenna 2 is connected to a circuit module 3. The connected antenna 2 and the module 3 are connected to a base film via adhesive. In case of adhering, the module 3 is disposed on the film so that the module 3 is eccentrically disposed to the central axis of an IC card 1. The film is formed of a material having high heat resistance, and the antenna 2 and module 3 are not only disposed suitably at a suitable position but also the film is used as one side surface of the noncontact card 1. Thus, at the time of molding, the antenna 2 is not disengaged by a flowing force of the resin. |
