| 摘要 |
PROBLEM TO BE SOLVED: To provide an abrasive cloth dressing device which is employed in the flattening process of a semiconductorwafer, and in particular, in which the cross sectional shape of the abrasive cloth can be observed. SOLUTION: A surface plate 11 provided with an abrasive cloth is rotated at a constant speed and a disc-shaped dresser 12 is opposed to the surface plate 11 and an abrasive layer pattern with electrodeposited diamond particles is formed on the contact surface of the dresser 12 with the surface plate 11. The dresser 12 is supported by a rotary shaft 14, which is joined to the dresser 12 by a self-aligning bearing mechanism 15, and is displaced to the cross sectional shape of the abrasive surface of the surface plate 11. The displacement of the dresser 12 is detected by displacement sensors 16a to 16c to observe the cross sectional shape of the abrasive cloth and is feedback-controlled. Therefore, the abrasive cloth is ground such that the cross sectional shape thereof is made flat, whereby the abrasive surface is uniformly attached to the surface of the wafer to be ground. |
