| 摘要 |
PROBLEM TO BE SOLVED: To improve surface smoothness of an IC card by preventing removal of a connecting part of components due to extension of adhesive in a manufacturing step, improving a product yield, preventing damage of the component due to bending and breakage of the connecting part, and improving reliability of the card. SOLUTION: This IC card is sealed by cured adhesive 6 between opposed base plates with all components, and at least a connecting part of IC chip 3 and an antenna 7 is protected with an elastomerlike material. The elastomer- like material further protects the overall IC chip 1, elastic modulus of the elastomer-like material is 1 to 100 kgf/mm<2> , and silicone rubber. And, the adhesive 6 is epoxy. |
