| 摘要 |
PROBLEM TO BE SOLVED: To detect polishing efficiency on the spot by detecting sliding resistance acting between a polishing pad surface and a semiconductor base board, and also premeasuring the relationship between the sliding resistance and the polishing efficiency. SOLUTION: At polishing, a sliding resistance signal from a load converter 1 is inputted to a personal computer 18 after A/D conversion is performed by an A/D converter 20, and is converted into polishing efficiency from reference data 21 on premeasured sliding resistance and polishing efficiency. A polishing quantity is calculated by integrating this polishing efficiency in polishing time. The calculated polishing quantity is displayed on a display 19, and when it reaches a desired polishing quantity, a stopping signal is sent to a surface plate driving motor controller 17, and a surface plate driving motor 11 is automatically stopped. The polishing efficiency at polishing is also monitored at any time, and when the polishing efficiency reduces more than a prescribed value, a sequence of automatically dressing a polishing pad 5 is performed. |
