| 摘要 |
<p>PURPOSE:To improve the working efficiency by forming a wafer sheet out of thermoshrinking resin, and equipping a heating mechanism which heats the wafer sheet based on the finish of the takeout of a semiconductor pellet and removes the relaxation of the wafer sheet by elongation. CONSTITUTION:When a wafer sheet is heated by a heating mechanism 10 based on the finish of takeout of a semiconductor pellet 3, this wafer sheet 2 shrinks because it is formed of thermoshrinking synthetic resin, and the relaxation is dissolved. Accordingly, in case of removing a ring holder 1 and taking it out together with the wafer sheet 2 in the arrow A direction, the defects, such as the wafer sheet 2 is caught at the angle of the round hole 5 of a wafer sheet fixing base 4, etc., do not occur. Hereby, takeout of the ring holder 1 is done smoothly, and the replacement can be done promptly.</p> |
