| 摘要 |
<p>A method of applying metallized contacts to the surfaces of semiconductor substrates using a conventional pad printing device. Standard screen printing inks diluted 2-30 weight percent with an appropriate solvent have been satisfactorily used to accomplish the method. For certain contact configurations, portions of the surface of the substrate are covered with a Mylar mask during the pad printing process. The method makes it possible to form a metallized contact having a uniform thickness on an uneven substrate surface, e.g., the surface of a silicon substrate produced by the EFG method.</p> |
