| 摘要 |
PROBLEM TO BE SOLVED: To accurately control a dressing condition by measuring a surface condition of a polishing tool dressed in a dressing process, and judging a finish of dressing of the polishing tool by its measured value. SOLUTION: Dressing is started, and a dresser 21 moves downward toward a polishing tool 15, and is pressed to the polishing tool 15. A surface condition measuring machine 23 is actuated, and a surface condition of the polishing tool 15 is measured. When the fact that the surface condition of the polishing tool 15 is dressed up to a prescribed surface condition is judged, the dressing is stopped, and the dresser 21 is moved upward, and whether or not polishing work is finished is judged, When the other wafer is successively polished, polishing is repeated up to a finish of the polishing work. When a finish of the polishing work is judged, rotation of a polishing board 13 is stopped, and the polishing finishes. In this way, since a change in a surface condition of the polishing tool 15 is seized, a dressing condition can be accurately controlled. |
