GRINDING METHOD AND DEVICE USING DISTRIBUTOR RING

摘要

PROBLEM TO BE SOLVED: To provide a grinding method and device using a distributor ring which can effectively grinding liquid and can uniformly grind the surface of a wafer. SOLUTION: In a grinding device for grinding a wafer by pressing an abrasive cloth on a rotating wafer, the outer periphery of the wafer is surrounded by a distributor ring 24. In the distributor ring 24, grinding liquid guide grooves 50 bent in the rotational direction. Grinding liquid is supplied to the grooves inside the bent portions of the ginning liquid guide grooves 50 from a grinding liquid supply passage 60 and is guided inside the distributor ring 24 through the grooves inside the bent portions by the rotation of the distributor ring 24. Remaining grinding liquid containing abrasive waste remaining on an abrasive cloth is ejected outside the distributor ring 24 by the grooves outside the bent portions.