发明名称 METHOD FOR FUSION BONDING OF RESIN MOLDING
摘要 <p>PROBLEM TO BE SOLVED: To efficiently fusion bond a thermoplastic resin molding without deformation by emitting a microwave to the molding having specific water content and obtained by molding thermoplastic resin composition containing microwave heating medium. SOLUTION: In the case of fusion bonding thermoplastic resin molding, microwave heating medium is contained in thermoplastic resin of at least one of adhered part in the molding. As the medium, ferrite effective by dispersing it in thermoplastic resin or needle titanium oxide is exemplified. A ratio of the thermoplastic resin to the medium is preferably by weight as resin composition used for a part desired to be heated approximately (100:10) to (100:200). Further, it is important that moisture of the medium-containing resin composition to be emitted by microwave is set to about 1000 ppm or less or preferably about 300 to 10 ppm. To obtain predetermined moisture, it is vacuum dried before heating to 100 deg.C or lower.</p>
申请公布号 JPH10315335(A) 申请公布日期 1998.12.02
申请号 JP19970128633 申请日期 1997.05.19
申请人 MITSUI CHEM INC;DAIKA POLYMER KK 发明人 ASANUMA TADASHI;SHIMAMURA KATSUICHI;KONDO SHINICHI
分类号 C08J5/12;B29C65/14;B29K101/12;B29L9/00;C08K3/22;C08L101/00;(IPC1-7):B29C65/14 主分类号 C08J5/12
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