发明名称 COMBINATION PLATE FOR FULL ADDITIVE PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To improve printing accuracy and to lengthen the lifetime by extending an ultra-thin stainless steel on an inside region of an image area, and forming Tetoron or the stainless steel in a composite plate via a junction. SOLUTION: In the combination plate 10 for full additive printed circuit board, a material of an image area 5 is calendered with small elongation to form a gauze (extra-thin stainless steel) 4, and the composite plate using a gauze (Tetron) 2 is formed as a support for absorbing printing strain. A junction 3 having a width of about 25mm for fixing the area 5 of a size of 700×700 mm is provided on the gauze (Tetron) 2. The gauze (stainless steel) 4 having a thickness of 60μm is calendered to be pressed to 30 to 50μm of its thickness and the gauze (stainless steel) 4 is extended on an inside region of the area 5. The gauze (Tetron) 2 and gauze (stainless steel) 4 are formed on the composite plate via the part 3, and an emulsion is formed in a thickness of 10 to 20μm.
申请公布号 JPH10315650(A) 申请公布日期 1998.12.02
申请号 JP19970143001 申请日期 1997.05.19
申请人 HITACHI AIC INC 发明人 ITO KAZUNORI;BABA TOMOYUKI
分类号 B41C1/14;B41N1/24;H05K3/12;(IPC1-7):B41N1/24 主分类号 B41C1/14
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