| 摘要 |
PROBLEM TO BE SOLVED: To increase the yields of wafers polished and to shorten a time required to replace a polishing cloth by obtaining the surface state of the polishing cloth and a backing pad during polishing without using the measurement results of the flatness of the wafers. SOLUTION: A turntable 1 is fixedly provided with a polishing cloth 3 on the top and is rotated by a rotating mechanism 2 provided on the bottom. A polishing head 4 comprises a rotating and pressing mechanism 5, a shaft 6, and a wafer holding plate 7. A backing pad 8 is fixed to the bottom of the wafer holding plate 7 and a wafer 10 is sucked by the backing pad 8. An elasticity measuring unit 21 has a plurality of sensors 22 and can measure elasticity at a plurality of positions of the surface of the polishing cloth 3 at a time. Similarly, an elasticity measuring unit 31 has a plurality of sensors 32 and can measure elasticity at a plurality of positions of the surface of the backing pad 8 at a time. |
