METHODS AND APPARATUS FOR ETCHING SEMICONDUCTOR WAFERS,申请号EP19970907719-传众专利搜索

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发明名称	METHODS AND APPARATUS FOR ETCHING SEMICONDUCTOR WAFERS
摘要
申请公布号	EP0880799(A1)	申请公布日期	1998.12.02
申请号	EP19970907719	申请日期	1997.02.14
申请人	LAM RESEARCH CORPORATION	发明人	ABRAHAM, SUSAN, C.
分类号	C04B41/53;H01L21/3213;(IPC1-7):H01L21/302;H01L21/321	主分类号	C04B41/53
代理机构		代理人
主权项
地址

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