发明名称 |
Methods of fabricating ferroelectric capacitors |
摘要 |
Methods of producing ferroelectric capacitors where the electrodes are formed in a contact hole. These methods include the steps of forming an insulating layer on an integrated circuit substrate. A contact hole is then formed through the insulating layer layer to expose a region of the integrated circuit substrate and to define a storage node pattern. A layer of oxidation-resistant conductive material is formed in the contact hole and the insulating layer removed to define a first storage electrode by exposing the layer of oxidation-resistant conductive material. A ferroelectric layer is then formed on the first storage electrode and a second storage electrode is formed on the ferroelectric layer opposite the first storage electrode.
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申请公布号 |
US5843818(A) |
申请公布日期 |
1998.12.01 |
申请号 |
US19960760576 |
申请日期 |
1996.12.03 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JOO, SUK-HO;MOON, JONG |
分类号 |
H01L21/28;H01L21/02;H01L21/822;H01L21/8242;H01L27/04;H01L27/108;(IPC1-7):H01L21/20;H01L21/824 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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