发明名称 Methods of fabricating ferroelectric capacitors
摘要 Methods of producing ferroelectric capacitors where the electrodes are formed in a contact hole. These methods include the steps of forming an insulating layer on an integrated circuit substrate. A contact hole is then formed through the insulating layer layer to expose a region of the integrated circuit substrate and to define a storage node pattern. A layer of oxidation-resistant conductive material is formed in the contact hole and the insulating layer removed to define a first storage electrode by exposing the layer of oxidation-resistant conductive material. A ferroelectric layer is then formed on the first storage electrode and a second storage electrode is formed on the ferroelectric layer opposite the first storage electrode.
申请公布号 US5843818(A) 申请公布日期 1998.12.01
申请号 US19960760576 申请日期 1996.12.03
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JOO, SUK-HO;MOON, JONG
分类号 H01L21/28;H01L21/02;H01L21/822;H01L21/8242;H01L27/04;H01L27/108;(IPC1-7):H01L21/20;H01L21/824 主分类号 H01L21/28
代理机构 代理人
主权项
地址