发明名称 Appratus for liquid thermosetting resin molding using radiofrequency wave heating
摘要 A method and apparatus for liquid thermoset resin or polymer molding using electromagnetic waves (particularly radiofrequency waves or microwaves), is described. The method and apparatus uses a metal mold (10, 212) with a cavity (401) for the molding as well as for confinement of the electromagnetic waves. Multiple low loss ports (A, B, C, D, E, p1, p2, p3) are provided for introducing the microwaves into the cavity.
申请公布号 US5844217(A) 申请公布日期 1998.12.01
申请号 US19970936412 申请日期 1997.09.25
申请人 BOARD OF TRUSTEES OPERATING MICHIGAN STATE UNIVERSITY 发明人 HAWLEY, MARTIN C.;ASMUSSEN, JR., JES;WEI, JIANGHUA;SHIDAKER, TRENT A.
分类号 B29C33/56;B29C35/08;B29C37/00;B29C45/00;H05B6/80;(IPC1-7):H05B6/80;H05B6/70 主分类号 B29C33/56
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