| 摘要 |
A semiconductor chip (16) has a shape of a quadrangle. Bumps (17A, 17B) are arranged in a staggered fashion along at least one side of the semiconductor chip, and include first bumps (17A) and second bumps (17B) arranged inside the first bumps (17A). If each of the first bumps (17A) has a maximum width Bw1 and each of the second bumps (17B) has a maximum width Bw2 in a direction parallel to at least one side of the semiconductor chip, Bw2 > Bw1. If each of the first bumps (17A) has a maximum length Bd1 and each of the second bumps (17B) has a maximum length Bd2 in a direction perpendicular to at least one side of the semiconductor chip, Bd1 > Bd2. <IMAGE> |
