| 摘要 |
A process for preparing phenolepoxy resin represented by the following formula: <IMAGE> wherein: (a) R1, R2, R3, and R4, which can be the same or different, are hydrogen, C1 to C6 alkyl groups, C6 to C10 aromatic groups, or C1 to C6 alkyl group-substituted C6 to C10 aromatic groups; (b) R5 and R6, which can be the same or different, are hydrogen, C1 to C6 alkyl groups, C6 to C10 aromatic groups, or C1 to C6 alkyl group-substituted C6 to C10 aromatic groups; <IMAGE> <IMAGE> (c) R7 is hydrogen, C1 to C6 alkyl groups, C6 to C10 aromatic groups, or C1 to C6 alkyl group-substituted C6 to C10 aromatic groups; (d) R8 and R9, which can be the same of different, are hydrogen, C1 to C6 alkyl groups, C6 to C10 aromatic groups, or C1 to C6 alkyl group-substituted C6 to C10 aromatic groups; and (e) n is an integer of 0 or 1. The phenolepoxy resin can be advantageously used in making packaging materials for ICs, as a substrate additive for printed circuit boards, and as adhesive for the electronic industry. The process includes the steps of preparing a reaction medium which contains only polyphenol, epihalohydrinl and an imidazole catalyst, and then causing the reaction medium to react in the absence of an aqueous phase.
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