发明名称 |
Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method |
摘要 |
A wire bonding method includes a first bonding process for forming a first ball-shaped part in a wire and bonding the first ball-shaped part to a first connected member; a ball-shaped part forming process for guiding the wire away from a position where the wire is bonded to an inner lead so as to form a predetermined loop, and forming a second ball-shaped part in a predetermined position in the wire; and a second bonding process for bonding the second ball-shaped part to a semiconductor element pad that serves as a second connected member.
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申请公布号 |
US5842628(A) |
申请公布日期 |
1998.12.01 |
申请号 |
US19960628936 |
申请日期 |
1996.04.08 |
申请人 |
FUJITSU LIMITED |
发明人 |
NOMOTO, RYUJI;TSUJI, KAZUTO;SATO, MITSUTAKA;KASAI, JUNICHI |
分类号 |
B23K20/00;H01L21/607;(IPC1-7):B23K31/02 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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