A SEMICONDUCTOR EQUIPMENT

摘要

A semiconductor device includes a package accommodating a semiconductor chip, and a plurality of connecting leads. One end portion of each connecting lead being attached to the semiconductor chip by an adhesive member and the other end portion thereof being external to the package and connected to a circuit substrate. The semiconductor device further includes at least one heat-emitting lead whose one end portion is attached to the semiconductor chip by the adhesive member and whose other end portion is external to the package and is separated from the circuit substrate. The semiconductor device also includes a heat-emitting body inserted into the adhesive member and having one portion thereof connected to the heat-emitting lead.