Method for testing semiconductor packages using decoupling capacitors to reduce noise

摘要

A method for the testing semiconductor packages is provided. The method includes electrically connecting a decoupling capacitor directly to the leads of the semiconductor package being tested, or alternately, directly to contact members of an electrical connector for the package. The decoupling capacitor is formed as a thin film capacitor that is mounted on the electrical connector of a testing apparatus such as a burn-in board. In an illustrative embodiment, the decoupling capacitor is configured with a power contact that contacts the Vcc lead for the package and a ground contact that contacts the Vss lead for the package. The decoupling capacitor functions to reduce power supply noise and spurious signals during testing of the integrated circuits formed on the semiconductor die contained within the package.