| 摘要 |
A wire bonding apparatus has an image pickup unit for obtaining image data of an image frame of a square area encompassing wire bond objects including electrode pads of an IC chip and corresponding inner leads of a lead frame. The image of the square area is picked up at the bonding station where the bonding operation is executed. The image data is transmitted to an image processing unit, which detects the position of each of inner leads and electrode pads and calculating deviations of position of each of wire bond objects from corresponding design position stored in a memory unit. A control unit controls XY-table based on the deviations to align a bonding tool to each of the bonding points of the wire bond objects. In the case of lead frames, tape carriers or ceramic packages, the accuracy of wire bonding can be improved without being affected by deformation of the inner leads due to transportation, thermal deformation, thermal expansion, or vibration remaining in the image pickup unit. In addition, the amount of time required for the detecting operation can be reduced. <IMAGE> |
