| 发明名称 |
Semiconductor unit with semiconductor device mounted with conductive adhesive |
| 摘要 |
A semiconductor unit, in which a semiconductor device having protruding electrodes is mounted face down onto the terminal electrodes of a circuit board through a bonding layer made of at least two kinds of conductive adhesive, and a method for manufacturing the semiconductor unit.
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| 申请公布号 |
US5844320(A) |
申请公布日期 |
1998.12.01 |
| 申请号 |
US19970812754 |
申请日期 |
1997.03.06 |
| 申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
ONO, MASAHIRO;BESSHO, YOSHIHIRO |
| 分类号 |
C09J163/00;H01L21/56;H01L21/60;H05K3/32;(IPC1-7):H01L23/48 |
主分类号 |
C09J163/00 |
| 代理机构 |
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