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发明名称
STACKED PACKAGE USING LEAD-ON-CHIP TYPE LEAD FRAME HAVING A PLURALITY OF INNER LEADS SELECTIVELY CORRESPONDING TO SPECIFIED BONDING PAD OF CHIP
摘要
申请公布号
KR0161619(B1)
申请公布日期
1998.12.01
申请号
KR19950042101
申请日期
1995.11.18
申请人
SAMSUNG ELECTRONICS CO.,LTD
发明人
AHN, MIN-CHUL;CHOE, KI-WON
分类号
H01L23/04;(IPC1-7):H01L23/04
主分类号
H01L23/04
代理机构
代理人
主权项
地址
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