发明名称 |
Die pad structure for solder bonding |
摘要 |
A lead frame having a die pad of such a shape that prevents scattering of solder to lead when a chip is mounted on the lead frame, and a semiconductor device using such a lead frame are provided. The lead frame includes a die pad having a region surrounded by a first side, a second side opposing to the first side, a third side different from the first and second sides, and a fourth side opposing to the third side, and a lead formed of a conductor and electrically connected to a semiconductor element. The die pad includes a notch extending along the first and the second sides and positioned opposing to a main surface of the semiconductor element, and a through hole extending along the third and fourth sides and positioned opposing to the main surface of the semiconductor element. The semiconductor device employs the die pad.
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申请公布号 |
US5844306(A) |
申请公布日期 |
1998.12.01 |
申请号 |
US19960590797 |
申请日期 |
1996.01.24 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA;SHIKOKU INSTRUMENTATION CO., LTD. |
发明人 |
FUJITA, KAZUMOTO;IWATA, TAKASHI;KUROKAWA, TETSUYA |
分类号 |
H01L23/28;H01L23/495;H01L23/50;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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