发明名称 |
Process for making ink jet heater chips |
摘要 |
A process is disclosed for fabricating a thermal inkjet printhead in which the driving circuitry and heating resistors are incorporated in a single integrated circuit. In the process, a protective cavitation layer, which may contain tantalum, is deposited at the locations of the heating regions over a passivation layer and is then patterned prior to any patterning or etching of the passivation layer. A via is then formed in the passivation layer.
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申请公布号 |
US5844586(A) |
申请公布日期 |
1998.12.01 |
申请号 |
US19960628059 |
申请日期 |
1996.04.08 |
申请人 |
STANDARD MICROSYSTEMS CORPORATION |
发明人 |
BERRY, KAREN L.;MANIACI, JOSEPH P. |
分类号 |
B41J2/14;B41J2/16;(IPC1-7):B41J2/05;H01L29/76;H01L29/00 |
主分类号 |
B41J2/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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