| 摘要 |
A method of orienting wafers in an apparatus having a wafer receiving-workpiece holder such as an electro-static chuck for processing of the wafers and eliminating etch debris build-up at the wafer orienting notch. The method comprises the steps of first providing a plurality of wafers, each wafer having an orientation mark thereon and then securing a first wafer in the chuck with the first wafer orientation mark in a first position with respect to the chuck. Thereafter, the first wafer is removed from the chuck after desired processing of the first wafer. A subsequent wafer is secured in the chuck with the subsequent wafer orientation mark in a second position with respect to the chuck different than the first position. The position of the subsequent wafer orientation mark may be rotated a predetermined desired degree with respect to the position of the first wafer orientation mark, for example, between about 1 and 30 degrees with respect to the position of the first wafer orientation mark, more preferably between about 4 and 9 degrees. Alternatively, the position of the subsequent wafer orientation mark may be rotated a random degree with respect to the position of the first wafer orientation mark.
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