| 摘要 |
An apparatus for rapidly and automatically handling packaged integrated circuits (ICs) during the loading or unloading of burn-in boards. The apparatus also segregates and offloads packaged ICs into a plurality of reservoirs for controlled delivery into suitable transport media on the basis of the level of functionality attained by each part during the burn-in process. The apparatus is computer controlled, with operator interface and an electronic control panel. The apparatus employs a linear induction motor drive system to rapidly, precisely and accurately move the ICs both between a loading/unloading location and a staging location, and at the staging location itself during the segregation and offloading steps. The system may be extended to operate in either the single or dual mode, employing two sorting and offloading components to unload a single device under test board. The apparatus uses an indexing table to controllably move an array of sockets on a burn-in board in a stepwise manner, such that one or more sockets (preferably a row of sockets) may be accurately located beneath insertion/extraction heads so that ICs may be sequentially loaded or sequentially unloaded. In one embodiment particularly applicable to burn-in boards having low-insertion-force sockets, extracted ICs are placed on a staging tray by gripper-type insertion/extraction heads. In another embodiment particularly applicable to burn-in boards having zero-insertion-force sockets, vacuum-type insertion/extraction heads are mounted on a support member which is coupled to the linear induction motor.
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