| 摘要 |
PCT No. PCT/GB95/00259 Sec. 371 Date Oct. 2, 1995 Sec. 102(e) Date Oct. 2, 1995 PCT Filed Feb. 2, 1995 PCT Pub. No. WO95/22170 PCT Pub. Date Aug. 17, 1995The invention relates to apparatus for use in a process in which a layer is formed on a surface of a workpiece and then forced into underlying voids. The apparatus for applying elevated pressure to the workpiece 1 comprises a chamber 103 (which includes a workpiece support 109a) means 108 for flooding the chamber 103 with liquid to immerse a workpiece 1 on the support 109a and means for applying a pulse of elevated pressure to the liquid and hence the workpiece. These means may include a liquid reservoir 102, which shares a common flexible wall 101 with the chamber 103, and electrodes 100 and 104 to which a high voltage pulse can be supplied to create a shock in the liquid of reservoir 102 which is transmitted to the liquid in 103 via the wall 101.
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