| 发明名称 |
Heated substrate support structure |
| 摘要 |
A heated substrate support plate for use in a process chamber. The support plate has grooves disposed therein for receiving heating elements. The heating elements are comprised of an outer sheath, a heater coil and a heat-conducting filler material. The heating element is disposed within a groove and compressed to compact the heat-conducting filler material about the heater coil.
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| 申请公布号 |
US5844205(A) |
申请公布日期 |
1998.12.01 |
| 申请号 |
US19960635270 |
申请日期 |
1996.04.19 |
| 申请人 |
APPLIED KOMATSU TECHNOLOGY, INC. |
发明人 |
WHITE, JOHN M.;CHANG, LARRY |
| 分类号 |
H01L21/683;C23C16/458;C23C16/46;C30B25/10;C30B25/12;H01L21/00;H01L21/205;H01L21/687;(IPC1-7):F27B5/14;F28F7/00 |
主分类号 |
H01L21/683 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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