发明名称 Adhesive premixture for flexible printed lead plate
摘要 A premixture for an adhesive for a flexible printed lead plate comprises: (a) 100 pts. wt. epoxy resin with two epoxy groups per mol.; (b) 30-100 pts. wt. rubber containing a functional group selected from -COOH, -CN and -OH; (c) 0.01-1.0 pts. wt. of a tert. amine as primary catalyst; (d) 100-400 pts. wt. solvent; and (e) 2-30 pts. wt. filler. Also claimed are (i) an adhesive comprising (a) - (e) as above and additionally, (f) 2-20 pts. wt. setting agent and (g) 0.1-10 pts. wt. setting catalyst; (ii) the preparation of the adhesive by forming a solution of (a)-(e) and pre-polymerising at 60-120 deg C, then mixing with 2-20 pts. wt. setting agent and 0.1-10 pts. wt. setting catalyst.
申请公布号 DE19738208(A1) 申请公布日期 1998.11.26
申请号 DE1997138208 申请日期 1997.09.02
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, CHUTUNG, HSINCHU, TW;MEK TEC CORP., KAOHSIUNG, TW 发明人 TSENG, TSENG-YOUNG, TAOYUAN HSIEN, TW;HWANG, YEONG-TSYR, HSINCHU, TW;LI, HSIAO-CHIAN, HSINCHU, TW
分类号 H05K3/38;(IPC1-7):C09J163/00;H01B3/40;C08K5/17;C08K7/04;C08K5/341;C09J109/02 主分类号 H05K3/38
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