Adhesive premixture for flexible printed lead plate
摘要
A premixture for an adhesive for a flexible printed lead plate comprises: (a) 100 pts. wt. epoxy resin with two epoxy groups per mol.; (b) 30-100 pts. wt. rubber containing a functional group selected from -COOH, -CN and -OH; (c) 0.01-1.0 pts. wt. of a tert. amine as primary catalyst; (d) 100-400 pts. wt. solvent; and (e) 2-30 pts. wt. filler. Also claimed are (i) an adhesive comprising (a) - (e) as above and additionally, (f) 2-20 pts. wt. setting agent and (g) 0.1-10 pts. wt. setting catalyst; (ii) the preparation of the adhesive by forming a solution of (a)-(e) and pre-polymerising at 60-120 deg C, then mixing with 2-20 pts. wt. setting agent and 0.1-10 pts. wt. setting catalyst.
申请公布号
DE19738208(A1)
申请公布日期
1998.11.26
申请号
DE1997138208
申请日期
1997.09.02
申请人
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, CHUTUNG, HSINCHU, TW;MEK TEC CORP., KAOHSIUNG, TW