APPARATUS AND METHOD FOR SPUTTER DEPOSITING DIELECTRIC FILMS ON A SUBSTRATE

摘要

Apparatus and method for sputter depositing a layer of material comprises a sputtering chamber (10) having an internal conductive wall (12) which provides an electrical reference for plasma during sputter deposition. A conductive shield (32) positioned in the processing space (14) of the chamber (10) between the target (20) and the substrate (24) is configured for capturing sputtered material which would deposit on the chamber wall surface (12) during sputter deposition. The conductive shield (32) reduces the amount of sputtered material (40) depositing on the chamber wall (12) and maintains a surface portion of the wall (12) as a generally stable electrical reference for the plasma and is further operable for passing plasma therethrough during deposition to contact the stable electrical reference.