| 摘要 |
<p>An improved interconnection ball joint for a ball grid array integrated circuit package includes a substrate base (11) having a first surface to which an integrated circuit die (10) is affixed, and an opposite second surface. A metallized via (15) extends through the substrate. The via (15) has a central hole which extends through the substrate. The hole is plugged with a flexible nonconductive material, such as epoxy solder mask material. A metallic interconnection ball land (21) is on the second surface of the substrate, integral with the metallized via and adjacent to the hole and the plug of nonconductive material. A solder interconnection ball (22) is formed on the land, opposite the via and the plug of nonconductive material. A metal-to-metal annular bond is formed at the joint between the interconnection ball (22) and the land (21) around the plug of nonconductive material in the center of the via.</p> |
