发明名称 Printed wiring board
摘要 <p>An insulative magnetic layer is disposed between a power source conductor layer and a ground conductor layer of a printed-wiring board. Two pieces of conductors are formed by cutting out a part of the power source conductor layer. Another two pieces of conductors are formed by cutting out a part of the ground conductor layer. The former conductors and the latter conductors are connected by five viaholes. A spiral coil inductor of a spiral form is formed in this way. This inductor has the strengthened inductance owing to the insulative magnetic layer provided therein. &lt;IMAGE&gt;</p>
申请公布号 EP0880150(A2) 申请公布日期 1998.11.25
申请号 EP19980109129 申请日期 1998.05.19
申请人 NEC CORPORATION 发明人 TOHYA, HIROKAZU;YOSHIDA, SHIRO;SHIMADA, YUZO
分类号 H01F1/34;H01F17/00;H01F27/00;H05K1/02;H05K1/11;H05K1/16;(IPC1-7):H01F17/00 主分类号 H01F1/34
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