A carrier head with a substrate detection mechanism for a chemical mechanical polishing system

摘要

A carrier head (100) for a chemical mechanical polishing system includes a substrate sensing mechanism. The carrier head includes a base and a flexible member (118) connected to the base to define a chamber (200). A lower surface of the flexible member (118) provides a substrate receiving surface (274). The substrate sensing mechanism includes a sensor to measure a pressure in the chamber (200) and generate an output signal representative thereof, and a processor configured to indicate whether the substrate is attached to the substrate receiving surface (274) in response to the output signal.