Rubber compositions for adhesion to organic resins and integrally bonded moldings

摘要

A rubber composition comprising (A) an uncured rubber, (B) an optional inorganic filler, (C) a compound having at least two phenyl skeletons and an acryl and/or methacryl group in a molecule, and (D) an organic peroxide can be molded and cured to an organic resin in a mold. The rubber is firmly bonded to the resin without a need for primers or adhesives. The molded part can be readily separated from the mold.