Venting hole designs for multilayer conductor-dielectric structures

摘要

Venting hole structures (10) are provided for an AC grounding plane (12) in a multichip module (MCM) or the like. The venting structure has alternating layers of metal (12) and dielectric materials (11, 13), such as copper and polyimide, respectively, and enables gases trapped within the underlying dielectric layers (11) to escape. This can prevent delamination of the layers without disturbing the function of the AC grounding plane (12) of providing controlled impedance characteristics for signal lines disposed above and below the grounding plane (12).